CN code 8541 90 00 Parts

TARIC codes (10 digits): 1

Origin, preferential duty and next steps ›

Examples from the EU database of Binding Tariff Information (BTI). A ruling binds only its holder and many have expired — read them as guidance, not as a decision for your product.

• PIEZOELECTRIC CERAMIC TRANSDUCER STACK (NO CRYSTAL) FOR USE IN LASERS.

  8541 90 00 · GB 2018 · GBBTI503908753

• ALLOY WAFER LAPPED, SLICED, COATED AND POLISHED. FOR SPECIFIC USE IN PHOTOSENSITIVE (HIGH BRIGHTNESS LED) SEMICONDUCTOR DEVICES. THE WAFER IS ONLY COATED ON ONE SIDE. THE BACKSIDE IS LEFT AS POLISHED. THE WAFER IS NOT SUBJECT TO MASKING OR PATTERN GENERATING AT THE TIME OF IMPORT. DIMENSIONS: 150MM DIAMETER X 650 MICRONS THICKNESS.

  8541 90 00 · GB 2016 · GB503310706

• A SUBSTRATE MOUNT FOR AN X-RAY DETECTOR. SLICED AND LAPPED IN A PLATE FORMAT. FOR USE IN AN X-RAY. DIMENSIONS: 172MM X 145MM X 4MM. MADE FROM SILICON ALUMINIUM ALLOY.

  8541 90 00 · GB 2016 · GB503310804

• MOLYBDENUM DISCS USED IN THE ASSEMBLY OF OF POWER SEMI CONDUCTOR DIODES AND THYRISTORS AS THE SILICON WAFER SUBSTRATE

  8541 90 00 · GB 2014 · GB501916963

• MOLYBDENUM DISC IS USED AS A SUBSTRATE TO SUPPORT SEMICONDUCTOR WAFERS WITH A CERAMIC HOUSING. THE DISCS ALSO PROVIDE ELECTRICAL CONTACT AND TO ASSIST THE HEAT DISSIPATION. THESE DISCS ARE RECOGNIZED EXCLUSIVELY AS ASSEMBILIES FOR THE MANUFACTURING OF POWER SEMICONDUCTORS SUCH AS DIODES, THYRSITORS ETC.

  8541 90 00 · GB 2012 · GB122392789

• A SEMICONDUCTOR HOUSING OR CERAMIC SUBSTRATE WITH CONNECTIONS. THEY ARE MANUFACTURED USING TWO MATERIALS, COPPER AND CERAMIC. THE COPPER PIECES ARE USED TO MAKE CONTACT WITH A SEMICONDUCTOR. ONE CONTACT IS ATTACHED TO THE CERAMIC, THE OTHER IS SUPPLIED AS A SEPARATE PIECE WHICH IS THEN ATTACHED TO THE CERAMIC AFTER INSERTION OF THE SEMICONDUCTOR INTO THE HOUSING.

  8541 90 00 · GB 2010 · GB119697136

• MOLYBDENUM DISCS USED IN HE ASSEMBLY OF POWER SEMICONDUCTOR DIODES AND THYRISTORS AS THE SILICON WAFER SUBSTRATE. IT IS USED FOR ELECTRICAL AND THERMAL CONDUCTIITY, REMAINING A STABLE PLATFORM THROUGHOUT THE OPERATING CYCLE OF THE POWER SEMICONDUCTOR DEVICE. THE PRODUCT IS USED AS A SUBSTRATE TO SUPPORT SEMICIONDUCTOR WAFERS WITH A CERAMIC HOUSING. THE DISCS ALSO PROVIDE ELECTRICAL CONTACT AND…

  8541 90 00 · GB 2008 · GB117454869

• A semiconductor housing, manufactured using two materials; copper and ceramic. The copper pieces are used to make contact with a semiconductor. One contact is attached to the ceramic, the other is supplied as a separate piece which is then attached to the ceramic after insertion of the semiconductor into the housing.

  8541 90 00 · GB 2004 · GB113260422