HS subheading 8542 31 Processors and controllers, whether or not combined with memories, converters…

Origin, preferential duty and next steps ›

• 8542 31 11 Multi-component integrated circuits (MCOs)
• 8542 31 19 Other
• 8542 31 90 Other

Examples from the EU database of Binding Tariff Information (BTI). A ruling binds only its holder and many have expired — read them as guidance, not as a decision for your product.

• AN INTEGRATED CIRCUIT WHICH HAS THE FUNCTION OF A FIELD PROGRAMMABLE GATE ARRAY. THE FIELD PROGRAMMABLE GATE ARRAY IS A SEMICONDUCTOR DEVICE CONSISTING OF A MATRIX OF CONFIGURABLE LOGIC BLOCKS CONNECTED THROUGH PROGRAMMABLE INTERCONNECTS. THIS DEVICE HAS MORE THAN ONE SILICON ELEMENT. COMBINED IN A SINGLE LEAD FRAME.

  8542 31 11 · GB 2019 · GBBTI504520587

• THE PRODUCT IS AN INTEGRATED CIRCUIT CHIP CONTAINING A MICROPROCESSOR (SPARC) AND ASSOCIATED FUNCTIONS NETWORK, MEMORY CONTROLLER, CACHE, ..ETC. THIS CHIP IS HIGH-RELIABILTIY AND DESIGNED TO WORK IN HARSH ENVIRONMENTS SUCH AS AEROSPACE AND SPACE.

  8542 31 90 · IE 2019 · IEBTI19NT-14-8383-02

• INTEGRATED CIRCUIT WHICH ENABLES/CONTROLS COMMUNICATION BETWEEN THE USB AND THE VARIOUS DEVICES. THIS IC IS A COMPONENT ON A PCB UNIT. THE UNIT IS USED FOR TESTING PORTABLE ELECTRICAL APPLIANCES.

  8542 31 90 · IE 2018 · IEBTI18NT-14-6708

• ANALOG TAB. AN ANALOG TAB IS AN INTEGRATED CIRCUIT WHICH IS THE MAIN CONTROLLER IN A PACEMAKER. IT IS BASED ON CMOS TECHNOLOGY.

  8542 31 90 · IE 2017 · IE17NT-14-5183-02

• AN ELECTRONIC COMPONENT CALLED A SIP (SYSTEM IN PACKAGE) COMPONENT. SIP COMPONENTS ARE COMPOSED OF COMMERCIAL MEMORIES STACKED VERTICALLY AND ENCASED IN A HARD PLASTIC COMPOUND. THE PRODUCT IS CONSIDERED TO BE A PROCESSOR OR CONTROLLER.

  8542 31 90 · IE 2017 · IE17NT-14-4807-01

• MICROPROCESSORS IN THE FORM OF AN INTEGRATED CIRCUIT OF MOS TECHNOLOGY. MULTI-CHIP INTEGRATED CIRCUIT CONSISTING OF TWO OR MORE INTERCONNECTED MONOLITHIC INTEGRATED CIRCUITS

  8542 31 10 · IE 2014 · IE13NT-14-1974-2

• 16 BIT A/D CONVERTER INTEGRATED CIRCUIT. IN A 48 PIN QFD (QUAD FLAT NO LEADS) PACKAGE. APPROX 8 X 8 MM. DESIGNED FOR DIGITISING HIGH FREQUENCY, WIDE DYNAMIC RANGE SIGNALS UP TO INPUT FREQUENCIES OF 700 MHz.

  8542 31 10 · GB 2013 · GB122749278

• A SURFACE MOUNT MULTI-CHIP MODULE, DESIGNED FOR LOW FIELD 2-AXIS MAGNETIC SENSING, SUCH AS LOW COST COMPASSING AND MAGNETOMETERY. SIZE 5 X 3.6 X 1.0mm. LOW VOLTAGE OPERATIONS, BUILT IN SET/RESET DRIVE CIRCUIT SIGNAL PROCESSING FLEXIBILITY

  8542 31 90 · GB 2012 · GB121621714